Registered user since Sat 20 Dec 2025
Name:Jinyi Deng
Country:China
Affiliation:Tsinghua University
Contributions
2026
HPCA
- ReThermal: Co-Design of Thermal-Aware Static and Dynamic Scheduling for LLM Training on Liquid-Cooled Wafer-Scale Chips
- MoEntwine: Unleashing the Potential of Wafer-scale Chips for Large-scale Expert Parallel Inference
- FACE: Fully PD Overlapped Scheduling and Multi-Level Architecture Co-Exploration on Wafer
- TEMP: A Memory Efficient Physical-aware Tensor Partition-Mapping Framework on Wafer-scale Chips
HPCA/CGO/PPoPP/CC 2026-profile
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